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StratEdge High-performance Semiconductor Packages to be on Display at IMS2019, June 4-6, in Booth 361
Removes the heat from high-performance packages
SAN DIEGO–(BUSINESS WIRE)–StratEdge
Corporation, leader in the design, production, and assembly of
high-performance semiconductor packages for microwave, millimeter-wave,
and high-speed digital devices, will display its thermally-efficient
line of post-fired and molded ceramic semiconductor packages in Booth
361 at the International Microwave Symposium (IMS), being held in
Boston, MA, from June 4-6. StratEdge packages operate from DC to 63+ GHz
and dissipate heat from compound semiconductor devices such as gallium
nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These
packages enable compound semiconductor devices to meet the critical
requirements of markets such as telecom, mixed signal, VSAT, broadband
wireless, satellite, military, test and measurement, automotive,
down-hole, and MEMS.
“StratEdge packages accommodate the extreme demands of compound
semiconductor devices,” said Tim Going, president of StratEdge. “We
manufacture our packages to exacting specifications, using hardened or
post-fired ceramics that don’t shrink, substrates that dissipate heat,
and electrical transition designs for exceptionally low electrical
losses. To further ensure optimized performance, StratEdge Assembly
Services can package your devices in our new cleanroom, which is
equipped with the latest precision wire bonding and die attach systems.”
To arrange a meeting at IMS or for more information, contact StratEdge
at [email protected], shop at
the StratEdge store on Amazon.com,
and/or visit our website at www.stratedge.com.
Photo available at: https://www.stratedge.com/semiconductor-packaging.png
About StratEdge
StratEdge designs and manufactures high-performance semiconductor
packages and provides chip assembly services. We specialize in packages
for high-frequency, very high power, extremely demanding gallium
arsenide (GaAs) and gallium nitride (GaN) devices. We have a complete
line of post-fired, molded ceramic, and ceramic QFN semiconductor
packages that operate from DC to 63+ GHz. Our patented electrical
transition designs give StratEdge packages exceptionally low electrical
losses, even at 63+ GHz. Markets served include telecom, mixed signal,
VSAT, broadband wireless, satellite, military, test and measurement,
automotive, down-hole, and MEMS. StratEdge is an ISO 9001:2015 facility.
Contacts
Casey Krawiec
StratEdge Corporation
Email: [email protected]
Phone:
(858) 569-5000
Fax: (858) 228-9728
Andrea Roberts
AR Marketing, Inc. (agency)
+1.858.204.9584
E-Mail:
[email protected]
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StickIt
StickIt Technologies Announces Investment into Ripco Processing Inc.
VANCOUVER, BC, May 21, 2024 /PRNewswire/ — StickIt Technologies Inc. (the “Company” or “StickIt”) (CSE: STKT), an Israeli technology and cannabinoid company, today announced an unsecured convertible debenture placement.
The $10,000 unsecured convertible debenture from StickIt, which matures on April 18, 2025, carries a 5% interest rate per annum and is payable at the end of the term. The convertible debenture can be automatically converted into Common Shares at a conversion price of $0.35 per Common Share at the election of the debenture holder.
The funds will be invested in Ripco Processing Inc., a cannabis processing and research and development facility located in Calgary, Alberta. Ripco, which has a team of experienced cannabis pioneers, focuses on creating unique, desirable cannabinoid-based products for recreational and medical use.
“Ripco is pleased to be working with Stickit in Canada. This relationship gets the amazing Stickit products into the Canadian market quickly, feeding directly into our existing distributions channels for immediate sales.”, says Ripco.
“Stickit, as an innovator in cannabis technologies, knows that its success in Canada in directly tied to the success of Ripco’s Stickit launch. We are happy to help our licensees achieve success with our products and we know Ripco does great work.”, said Eli Ben Haroosh, CEO of Stickit Technologies.
About StickIt Technologies Inc.
StickIt is a technology company that invented and manufactures innovative products (“devices”) that can contain varying quantities of CBD/THC for recreational and medical cannabis users. Its operating model is to establish joint ventures/licensees (“partners”) in countries around the world that will establish a production facility in which they will add the cannabinoid content to the “sticks” and “straws” produced and supplied by StickIt. The Company’s precise dosing options cater to a wide range of effects, including painkilling, energizing, focus, sleep improvement, etc., and can be tailored to meet local preferences and regulations. StickIt Technologies serves customers worldwide.
About Ripco Processing Inc.
Ripco, known for its innovative cannabis products, brings popular brands like Stickit and Stripit to the Canadian market. Stickit is an infused stick designed to enhance the performance of prerolls, promising to take user experiences to new levels – just Stickit!
Neither the Canadian Securities Exchange nor its Regulation Services Provider (as that term is defined in the policies of the Canadian Securities Exchange) accepts responsibility for the adequacy or accuracy of this press release.
Forward-Looking Statements
This news release includes certain statements and information that constitute forward-looking information within the meaning of applicable Canadian securities laws. All statements in this news release, other than statements of historical facts, are forward-looking statements. The Company provides no assurance that forward-looking statements and information will prove to be accurate, as actual results and future events could differ materially from those anticipated in such statements or information. Accordingly, readers should not place undue reliance on forward-looking statements or information. The Company does not undertake to update any forward-looking statements, other than as required by law. More detailed information about potential factors that could affect financial results is included in the documents filed from time to time with the Canadian securities regulatory authorities by StickIt Technologies Inc. Readers are cautioned not to place undue reliance on forward-looking statements.
For more information, please contact:
StickIt Technologies Inc.
Eli Ben Haroosh, CEO
E:[email protected]
Sophie Galper , CFO
E:[email protected]
Website: www.stickit-labs.com
Facebook: @Stickit
Twitter “X”: @STICKIT74776509
LinkedIn: @Stickit-labs
Logo: https://mma.prnewswire.com/media/2258883/Stickit_Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/stickit-technologies-announces-investment-into-ripco-processing-inc-302151258.html
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